报告时间：2024年6月13日 （星期四）14：00 – 16：00

报告地点：琶洲实验室主楼 一楼学术报告厅

报告题目：Cyber-Physical Internet (CPI): Next-generation of resilient logistics of manufactured products

报告人：香港理工大学黄国全讲座教授

报告摘要：

The talk is about a major research project on Cyber-Physical Internet (CPI) recently initiated in Hong Kong. Its vision is to establish a new paradigm for sending and receiving manufactured goods just like sending and receiving instant messages over the internet using online chatting platforms. Four innovations are critical to achieving this ultimate vision: (1) digitization architecture for entangling the flows of information and materials into one flow of cyber-physical objects for manufacturing and logistics operations; (2) network services for configuring local area network (LAN), wide area network (WAN) and catchment area network (CAN); (3) value mechanisms to motivate and facilitate participation and collaboration between multiple stakeholders including shippers, carriers, forwarders; and (4) decision analytics for synchronized logistics planning, scheduling and execution. These innovations are based upon some fundamental breakthroughs of CPI routers and TCP/PIP (Transmission Control Protocol / Physical Internet Protocol) protocols that are yet to be developed. CPI contributes to establishing post-pandemic “new norms” while logistics resilience and CO2 emission targets are achieved.

报告人简介：

George is Chair Professor of Smart Manufacturing at the Department of Industrial and Systems Engineering and Director of the Research Institute for Advanced Manufacturing (RIAM) at the Hong Kong Polytechnic University. Prior to this appointment, he was Chair Professor of Industrial and Systems Engineering and Head of Department in Department of Industrial and Manufacturing Systems Engineering at The University of Hong Kong. He gained BEng and PhD in Mechanical Engineering from Southeast University (China) and Cardiff University (UK), respectively. He has conducted research projects in areas of Smart Manufacturing, Logistics, and Construction through IoT-enabled Cyber-Physical Internet and Systems Analytics. His research has been supported by substantial government and industrial grants. He has directed a strong research team and collaborated closely with leading academic and industrial organizations through joint projects and start-up companies. He has published extensively and his works have been highly cited by research communities. He serves as associate editors and editorial members for several international journals. He is Chartered Engineer (CEng), Fellow of IEEE, IISE, ASME, HKIE, IET and CILT.